AMAOE EMMC2 BGA REBALLING STENCIL FOR EMMC/EMCP/UFS IC CHIP 0.15MM

Description :
0.15MM Amaoe BGA Stencil FOR EMMC/EMCP/UFS IC Chip Reballing Pins Solder Tin Plant Net Heating Template EMMC:2.
Features :
1. Brand New.
2. BGA stencil for reballing pins, BGA Stencil Car PC Board Controller IC Reballing Pins Solder Tin Plant Net Amaoe Square Hole Heating Steel Mesh.
Advantage:
1. Deformation resistant material
2. Precise pins location
3. Square round hole
4. Good material
MODEL NUMBERS SUPPORTED :
BGA221
BGA153
BGA169
BGA254
BGA162
BGA186
Package Content*
1x AMAOE BGA REBALLING STENCIL FOR EMMC/EMCP/UFS IC CHIP 0.15MM