AMAOE EMMC1 BGA REBALLING STENCIL FOR EMMC/EMCP/UFS IC CHIP 0.15MM
Out of stock
AMAOE EMMC1 BGA REBALLING STENCIL FOR EMMC/EMCP/UFS IC CHIP 0.15MM
Rs.249.00 Rs.299.00
Out of stock
Description :
Amaoe EMMC EMCP BGA Reballing Stencil for UFS Font BGA153 162 169 186 221 254 Universal Reballing Stencil 0.15mm.
0.15MM Amaoe BGA Stencil FOR EMMC/EMCP/UFS IC Chip Reballing Pins Solder Tin Plant Net Heating Template EMMC:2.
Features :
1. Brand New.
2. BGA stencil for reballing pins for MPC5554MZP132 BGA Stencil Car PC Board Controller IC Reballing Pins Solder Tin Plant Net Amaoe Square Hole Heating Steel Mesh
Advantage:
1. Deformation resistant material
2. Precise pins location
3. Square round hole
4. Good material
MODEL NUMBERS SUPPORTED :
BGA221
BGA153
BGA169
BGA254
BGA162
BGA186
Package Content*
1x AMAOE BGA REBALLING STENCIL FOR EMMC/EMCP/UFS IC CHIP 0.15MM
| Weight | 0.010 kg |
|---|---|
| Dimensions | 5 × 5 × 1 cm |
